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High Precision BGA Assembly aluminum for electronic product
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High Precision BGA Assembly aluminum for electronic product

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Special laminated structure

The matrix material is used as the substrate board (PP layer), coated with copper foil on one or both sides, and then made into the copper clad board (core layer) by hot laminating technology. PCBs with different layers are made by using the copper clad board and the substrate board with hot laminating. As circuit designs become more complex and high-speed, it has become a problem that how to ensure signal quality. In such a situation, we need to use the transmission line theory to analyze, and it becomes the key to control the characteristic impedance matching of the signal line. Inadequate impedance control will cause considerable signal reflection and distortion, leading to a failed design. Common signals, such as PCI bus, PCI-E bus, USB, Ethernet, DDR memory, LVDS signals, etc., all require impedance control. The impedance control ultimately needs to be realized by PCB design. Many times engineers will design out some special PP layers and core layers, considering to meet the impedance requirements. This also places higher requirements on the production capacity of PCB manufacturing factories. We have our own full set of production laminating equipments, helping us to strictly control the quality of laminated structures with special requirements.


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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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 ivan@pcbship.com 
   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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