Views: 0 Author: Site Editor Publish Time: 2021-07-02 Origin: Site
Bo Yun Fa is a printed circuit board company, located in Shenzhen, with 520 employees, 16000 square feet, who have offered Thick-Copper PCB Manufacturing Service for more than 10 years. With the state-of-the-art technologies we employ, along with our highly trained workforce, we are able to ensure that every PCB we provide matches your design requirements.
Thick-Copper PCBs are usually bonded with a layer of copper foil on glass epoxy substrate, and the thickness of the copper foil is usually 4 species, like 18 μm, 35μm, 55 μm and 70 μm. The most common thickness of the copper foil is 35 μm. The rigid plate is 0.4mm -4.0mm and the flexible plate is 0.025mm-0.15mm.
The following knowledge points are listed below:
(1) Preparation before plating and electroplating treatment
The main purpose of thickening copper plating is to ensure that there is enough thick copper coating in the hole to ensure that the resistance value is within the range of process requirements. As an insert, it can fix the position and ensure the connection strength; As a surface packaged device, some holes are only used as through holes to conduct electricity on both sides.
(2) Thick-Copper plating process
In order to do a good job of thickening copper plating process, we must do the following aspects. Firstly, according to the area value calculated by a computer and the experience constant accumulated in actual production, a certain value is added; secondly, according to the calculated current value, in order to ensure the integrity of the coating in the hole, it is necessary to add a certain value to the original current value, that is, the impact current, and then return to the original value in a short time; thirdly, when the circuit board is electroplated for 5 minutes, take out the substrate and observe whether the copper layer on the surface and the inner wall of the hole is complete, and it is better that all the holes are metallic luster; then there must be a certain distance between the substrates; the last, when the thickening copper plating reaches the required plating time, a certain amount of current should be maintained during the removal of the substrate to ensure that there will be no blackening or darkening in the surface and hole of the subsequent substrate.
(3) Quality Control of Thick-Copper PCBs
First of all, strictly implement the first article inspection system to ensure that the product size meets the design requirements; then according to the raw materials of the circuit board, reasonable selection of milling process parameters; after that when fixing the position of the circuit board, clamp it carefully to avoid damaging the solder layer and solder resist layer on the surface of the circuit board; in order to ensure the consistency of the overall dimensions of the substrate, the position accuracy must be strictly controlled afterwards; the last when disassembling, pay special attention to the backing layer of the substrate, so as to avoid damaging the coating layer on the surface of the circuit board.
Bo Yun Fa offers full turnkey Thick-Copper PCBs assembly services, which include PCB fabrication, component procurement, and PCB assembly. Our one-stop service negates the need for you to manage several suppliers across various timelines, thus increasing your efficiency and cost-effectiveness. we are fully responsive to our clients' needs and can provide a timely and personalized service.
