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Introduction to the advantages of HDI PCB

Views: 0     Author: Site Editor     Publish Time: 2021-07-14      Origin: Site


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Shenzhen Bo Yun Fa Technology ,one-stop service provider, located in Shenzhen, China. We focus on high density Interconnection PCB, components sourcing and PCB assembly for worldwide customers. Shenzhen is an international Electronic Industry Innovation Center, with rich component resources, efficient and convenient transportation. Next, we'll give you a detailed introduction to the advantages of HDI PCB

High density Interconnection printed circuit board (HDI PCB) is a kind of structural component, which is made of insulating material and conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. By connecting wires, electronic signal connection and proper function can be formed. Therefore, the printed circuit board is a platform to provide component connection, which is used to undertake the foundation of connecting parts.


The following advantages are listed below:

Impedance control of AC characteristics

High frequency transmission capability of HDI PCB

High Density Interconnection can reduce unnecessary radiation


(1) Impedance control of AC characteristics

In order to reduce the quality of signal transmission, insulating materials with low dielectric coefficients and low attenuation rates will be used. To cope with the miniaturization and array of electronic components, the density of circuit boards will be continuously increased to meet the demand. The appearance of BGA (ball grid array), CSP (chip scale package), DCA (direct chip attachment) and other assembly methods of group parts promotes printed circuit board to an unprecedented high density PCB.

(2) High frequency transmission capability of HDI PCB

As electronic products tend to be multi-functional and complex, the contact distance of integrated circuit components will be reduced, and the speed of signal transmission will be relatively improved, followed by the increase in the number of wiring, and the local shortening of the length of wiring between points. These require the application of high-density line configuration and micropore technology to achieve the goal. Wiring and bridging are basically difficult for single and double-sided boards. As a result, circuit boards tend to be multi-layered. With the increasing number of signal lines, more power layers and ground planes are necessary means for design. All of these make multilayer printed circuit boards more common

(3) High Density Interconnection can reduce unnecessary radiation

The hole of HDI PCB with a diameter less than 150um is called micro via in the industry. The circuit made by using this kind of micro hole geometry technology can improve the efficiency of assembly, space utilization and so on. At the same time, it is also necessary to reduce unnecessary radiation.


We offer full turnkey PCB assembly services, which include PCB fabrication, component procurement, and PCB assembly. Our one-stop service negates the need for you to manage several suppliers across various timelines, thus increasing your efficiency and cost-effectiveness. we are fully responsive to our clients' needs and can provide High Density Interconnection, etc. We are honored as the excellent supplier of many companies all around this world.


Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

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 ivan@pcbship.com 
   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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