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The resin plug hole is directly drilled from the pad to make a via to another layer to route, and then filled with resin and plated with copper to become a pad, which is commonly known as the VIP process (via in pad). Making vias on the pads without plugging the holes with resin will easily cause tin leakage, leading to short circuits on the back side or empty soldering on the front side. Commonly used for BGA components.
The resin plug hole is directly drilled from the pad to make a via to another layer to route, and then filled with resin and plated with copper to become a pad, which is commonly known as the VIP process (via in pad). Making vias on the pads without plugging the holes with resin will easily cause tin leakage, leading to short circuits on the back side or empty soldering on the front side. Commonly used for BGA components.
