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Substrate Size: The change in size of substrate weft/warp difference in direction. This occurs because of not paying any attention to the direction of fiber which is resulting in residual stress inside the board’s base, when released its direct impact is on the shrinkage of size of substrate.
Solution: The best possible solution to this problem is determining the change rule of direction of weft/warp as per the compensation of shrinkage of the film. Trim it at same time as per the direction of processing of fiber. Mostly the vertical direction of characters is used for that of the substrate’s longitudinal direction.
Copper Foil Etching: Sometimes a part of the substrate’ copper foil is etched away due to the restrictions because of changing the substrate for producing dimensional changes when stress is relieved.
Solution: The best solution for the problem is during the process of designing the circuit board, it must be tried to make the board in even distribution. If this is not possible, then some space for transition must be left which would not affect the circuit. This is due to the reason that plank structure of the cloth of glass and density difference of weft is leading to the differences in intensity of longitude to latitude of plank.
Substrate Size: The change in size of substrate weft/warp difference in direction. This occurs because of not paying any attention to the direction of fiber which is resulting in residual stress inside the board’s base, when released its direct impact is on the shrinkage of size of substrate.
Solution: The best possible solution to this problem is determining the change rule of direction of weft/warp as per the compensation of shrinkage of the film. Trim it at same time as per the direction of processing of fiber. Mostly the vertical direction of characters is used for that of the substrate’s longitudinal direction.
Copper Foil Etching: Sometimes a part of the substrate’ copper foil is etched away due to the restrictions because of changing the substrate for producing dimensional changes when stress is relieved.
Solution: The best solution for the problem is during the process of designing the circuit board, it must be tried to make the board in even distribution. If this is not possible, then some space for transition must be left which would not affect the circuit. This is due to the reason that plank structure of the cloth of glass and density difference of weft is leading to the differences in intensity of longitude to latitude of plank.
