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Since 1970s, PCB depended on flux to protect its circuit and passivation treatment was applied to stop copper oxidation by surface finish on pad, which aims to stop copper surface from oxidation. Solderability, however, was insured by second-time flux coating in the process of assembly. Then, some other types of surface finish came into being such as chemical gold plating, chemical tin plating, electroplated soldering and hot melting tin soldering and some products with high reliability applied electronickelling and electrogilding.
Since 1970s, PCB depended on flux to protect its circuit and passivation treatment was applied to stop copper oxidation by surface finish on pad, which aims to stop copper surface from oxidation. Solderability, however, was insured by second-time flux coating in the process of assembly. Then, some other types of surface finish came into being such as chemical gold plating, chemical tin plating, electroplated soldering and hot melting tin soldering and some products with high reliability applied electronickelling and electrogilding.
