Views: 0 Author: Site Editor Publish Time: 2022-04-20 Origin: Site
BGA refers to a ball grid array, which is an advanced packaging technology in SMT assembly. BGA is the result of the development of electronic technology and indicates the significant progress of package technology. There are many ball-shape bumps on the surface of the tube, which provides a lot of interconnection points to achieve high-density package purposes. BGA package offers short lead length and ample lead space, making
it an ideal solution for high-speed PCB products with high-density circuits.
The basic introduction of the BGA assembly
The advantages of the BGA assembly
Service available
Our advanced equipment in SMT assembly
Our BGA assembly capabilities
There are many ball-shape bumps on the surface of the tube, which provides a lot of interconnection points to achieve high-density package purposes. BGA assembly offers short lead length and ample lead space, making it an ideal solution for high-speed PCB products with high-density circuits.
Why do we treat the BGA assembly as an advanced assembly technology?
BGA assembly shows many advantages in high-density PCB products. there are three reasons. Firstly, BGA assembly allows small packages for ICs with hundreds of pins, which can integrate more functions while achieving less space utilization. Secondly, chip assembly has excellent electrical performance and heat conduction. Thirdly, chip assembly better solderability leads to good manufacturing yield. Due to these advantages, BGA assembly has been widely used in the LED industry, medical industries, wireless and telecommunications, military, aerospace, and satellite, etc.
BOYUNFA owns many professional engineers and high-end machines to provide BGA packages with high-quality and high-precision. Turnkey service for BGA assembly and other assembly ways is also available
Our advanced equipment in SMT assembly
We have a full automated SMT production line to ensure high accuracy and high yield of the assembly. Our latest equipment includes automated solder dispensing machines, automatic placement machines, reflow oven, X-ray and AOI inspection systems, and so on.
Our BGA assembly capabilities
BGA soldering traditionally is done through an automatic process because it needs precise control. BOYUNFA can build high-quality and reasonable yield rate BGA assembly PCBs for you. The minimum pitch size of BGA we can assemble is 0.25mm. We have these types of BGA assembly service:
Plastic BGA (PBGA)
Ceramic BGA (CBGA)
Micro BGA
Micro Fine Line BGA (MBGA)
Stack BGAs
Lead BGA and leadless BGA
Now, BGA assembly technology has been skillfully mastered by most manufacturers. But the quality is often uneven, so it is particularly important to choose a trusted partner. As a PCB manufacturer with years’ experience, BOYUNFA provides BGA assemblies above industry standard with strict factory inspection. It is advisable to do BGA assembly for your PCBs from experts, BOYUNFA must be your best choice. Boyunfa has a professional team to ensure that all your problems can be solved in our company, we just want to make our customers more relaxed, more assured and more secure.
