Resin plug hole
The resin plug hole is directly drilled from the pad to make a via to another layer to route, and then filled with resin and plated with copper to become a pad, which is commonly known as the VIP process (via in pad). Making vias on the pads without plugging the holes with resin will easily cause tin leakage, leading to short circuits on the back side or empty soldering on the front side. Commonly used for BGA components.
Boyunfa is a printed circuit board company, Located in Shenzhen,520 employees,16000 square feet, Who have offered PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.