Publish Time: 2022-04-25 Origin: Site
The basic introduction of the chip assembly
Ball pin grid array packaging technology, high-density surface-mount packaging technology. At the bottom of the package, the pins are spherical and arranged in a lattice-like pattern, which is named BGA. The main board control chipset mostly adopts this kind of packaging technology, and the material is mostly ceramic.
Space saving
The production rate of mounting is improved
It's good for heat dissipation
Improve circuit performance
Reduce assembly loss
BGA is suitable for MCM Packaging
More I / O. The I / O number ofBGA assembly is mainly determined by the package size and solder ball pitch. Because the solder balls of BGA package are arranged under the package substrate in the form of an array, the I / O number of the device can be greatly increased, the package size can be reduced, and the assembly space can be saved. Generally, the package size can be reduced by more than 30% with the same number of leads.
Chip assembly can improve the product rate and potentially reduce the cost. The lead pins of traditional QFP and PLCC devices are evenly distributed around the package. The pitch of lead pins is 1.27mm, 1.0mm, 0.8mm, 0.65mm and 0.5mm. When the number of I / O is more and more, the pitch must be smaller and smaller. When the pitch is less than 0.4mm, the accuracy of SMT equipment is difficult to meet the requirements.
The contact surface between the BGA array solder ball and the substrate is large and short, which is conducive to heat dissipation. The lower the resistance is, the better the thermal dissipation is. The thermal resistance is lower in BGA assembly, which helps to dissipate the heat from the integrated circuits and avoid the high temperature of the chip.
The lead of the BGA array solder ball is very short, which shortens the signal transmission path, reduces the lead inductance and resistance, so the performance of the circuit can be improved. We know that inductance would produce unwanted signal distortion in high-speed PCB applications. Therefore, low lead inductances mean that BGA assembly has better electrical characteristics and frequency characteristics in high-speed circuit boards.
Reduce assembly loss
The coplanarity of the I / O port is improved obviously, and the loss caused by poor coplanarity is greatly reduced.
BGA is suitable for MCM Packaging
As early as the 1980s, people put forward higher requirements for electronic miniaturization and the number of I / O pins. Although SMT has the characteristics of miniaturization, there are more stringent requirements for high I / O pin count, fine pitch components and coplanarity of leads. However, due to the limitations of manufacturing accuracy, manufacturability, cost and assembly technology, the limit spacing of QFP components is 0.3mm, which limits the development of high-density components. In addition, due to the strict requirements of assembly technology for fine pitch QFP components, their applications are limited. Component manufacturers turn to R & amp on BGA components, which are more advantageous than QFP components.
The limitation of fine pitch components is that their leads are easy to bend, break and be damaged, which requires high coplanarity and installation accuracy of leads. BGA assembly technology uses a new design thinking mode, that is, the round or cylindrical solder ball is hidden under the package, so the lead spacing is larger and the lead is shorter. Therefore, BGA assembly technology can solve the problems of coplanarity and warpage in fine pitch components.BGA is suitable for MCM Packaging and can achieve high density and high performance of MCM.
Shenzhen Bo Yun Fa Technology Co., Ltd, owns many professional engineers and high-end machines to provide BGA packages with high-quality and high-precision. Turnkey service for BGA assembly and other assembly ways is also available.
Boyunfa is a printed circuit board company, Located in Shenzhen,520 employees,16000 square feet, Who have offered PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.