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Ball Wire bonding On Flexible Substrate
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Ball Wire bonding On Flexible Substrate

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For Ball Wire bonding On Flexible Substrate, everyone has different special concerns about it, and what we do is to maximize the product requirements of each customer, so the quality of our Ball Wire bonding On Flexible Substrate has been well received by many customers and enjoyed a good reputation in many countries. BYF Ball Wire bonding On Flexible Substrate have characteristic design & practical performance & competitive price, for more information on the Ball Wire bonding On Flexible Substrate, please feel free to contact us.

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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 ivan@pcbship.com 
   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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