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Bare Die Copper Wire bonding In Microelectronics
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Bare Die Copper Wire bonding In Microelectronics

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The Bare Die Copper Wire bonding In Microelectronics is a new design, through excellent processing technology and high-quality raw materials, the performance of Bare Die Copper Wire bonding In Microelectronics up to a higher standard. We are perfect for every detail of the Bare Die Copper Wire bonding In Microelectronics, guarantee the quality level, so as to bring you the perfect product experience. BYF is a professional China Bare Die Copper Wire bonding In Microelectronics manufacturer and supplier, if you are looking for the best Bare Die Copper Wire bonding In Microelectronics with low price, consult us now!

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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