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Bare Die Wire bonding In Microelectronics
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Bare Die Wire bonding In Microelectronics

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BYF is a leading China Bare Die Wire bonding In Microelectronics manufacturer, supplier and exporter. Adhering to the pursuit of perfect quality of products, so that our Bare Die Wire bonding In Microelectronics have been satisfied by many customers. Extreme design, quality raw materials, high performance and competitive price are what every customer wants, and that's also what we can offer you. Of course, also essential is our perfect after-sales service. If you are interested in our Bare Die Wire bonding In Microelectronics services, you can consult us now, we will reply to you in time!

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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