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Bump Wire bonding On Tin
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Bump Wire bonding On Tin

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Maybe you are a Bump Wire bonding On Tin purchasing manager, who are looking for high quality Bump Wire bonding On Tin, and BYF are a professional manufacturer & supplier that can meet your needs. Not only Bump Wire bonding On Tin we produced have certificated the international industry standard, but we can also meet your customization needs. We provide online, timely service and you can get professional guidance on Bump Wire bonding On Tin. Don't hesitate to get in touch with us if you are interested in Bump Wire bonding On Tin, we won't let you down.

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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