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Double sided BGA Assembly for mobile phone main board
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Double sided BGA Assembly for mobile phone main board

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BYF as a professional Double sided BGA Assembly for mobile phone main board manufacturer and supplier in China, all the Double sided BGA Assembly for mobile phone main board have passed the international industry certification standards, and you can be completely assured of quality. If you do not find your own Intent Double sided BGA Assembly for mobile phone main board in our product list, you can also contact us, we can provide customized services.

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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