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High Precision BGA Assembly for mobile phone main board
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High Precision BGA Assembly for mobile phone main board

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With years of experience in production High Precision BGA Assembly for mobile phone main board, BYF can supply a wide range of High Precision BGA Assembly for mobile phone main board. High Precision BGA Assembly for mobile phone main board can meet many applications, if you need, please get our online timely service about High Precision BGA Assembly for mobile phone main board. In addition to the product list below, you can also customize your own unique High Precision BGA Assembly for mobile phone main board according to your specific needs.

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Rigid-flexible PCB manufacturing
Rigid-flexible PCB manufacturing
Place Of Origin : Guangdong, China Brand Name : UC-02 Model Number : Customized Base Material : FR-4 Min. Hole Size : 0.075mm(3mil) Min. Line Width : 0.1 0mm Min. Line Spacing : 0.1mm4mil) Surface Finishing : HASL Lead China : Guangdong Color : Green,Blue on your request Metrials : FR-4,Aluminum,CEM-1 etc Certificate : CE,ROHS,SGS etc OEM/ODM : Support MOQ : 1 PC Surface Finish : HASL lead free Copper Thickness : 0.25OZ~12OZ Silkscreen Color : White or on your request. PCBA Design : base on your request Copper Thickness : 1oz Board Thickness : 0.2-6.0mm
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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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   Xueziwei Industrial Zone, Yabian, Shajing Street, Baoan District, Shenzhen.

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