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Theoretically, PCB (Printed Circuit Board) current carrying capacity is determined by cross-sectional area of trace and temperature rise. Furthermore, cross-sectional area of trace is directly proportional to trace width and copper thickness. Well, here comes a question: does this rule also apply to the relationship between current carrying capacity and trace cross-sectional area, that is, is trace carrying capacity directly proportional to its cross-sectional area? Under the same temperature rise that is 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at most and we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp. Then how exactly is the maximum current it is able to hold, 5amps based on a simple multiple calculation? It's actually far more complicated than that. According to MIL-STD-275, we are told that the maximum current a 50mil-trace can stand is 2.6amps.
Theoretically, PCB (Printed Circuit Board) current carrying capacity is determined by cross-sectional area of trace and temperature rise. Furthermore, cross-sectional area of trace is directly proportional to trace width and copper thickness. Well, here comes a question: does this rule also apply to the relationship between current carrying capacity and trace cross-sectional area, that is, is trace carrying capacity directly proportional to its cross-sectional area? Under the same temperature rise that is 10°C, a 10mil-trace with 1oz copper weight is capable of withstanding current of 1amp at most and we rest assured that a 50mil-trace is capable of withstanding current larger than 1amp. Then how exactly is the maximum current it is able to hold, 5amps based on a simple multiple calculation? It's actually far more complicated than that. According to MIL-STD-275, we are told that the maximum current a 50mil-trace can stand is 2.6amps.
