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Copper Ultra Low Loop Wire bonding On Flexible Substrate
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Copper Ultra Low Loop Wire bonding On Flexible Substrate

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Under the premise that electronic products tend to be multi-functional and complex, "small, precise, and ingenious" is the eternal pursuit. The connect distance of integrated circuit components has been reduced, and the speed of signal transmission has been increased. This is followed by an increase in the number of wiring and a local shortening of the length of the wiring between points. These require the application of high-density circuit configurations and microvias technology to complete. HDI board is a circuit board with high line distribution density that uses high-density interconnection technology and is processed by micro-blind and buried vias. It is widely used in mobile phones, digital (camcorder) cameras, automotive electronics and other digital products, among which mobile phones are the most widely used. As the technology matures, the application will become more and more extensive.


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Boyunfa is a printed circuit board  company, Located in Shenzhen,520 employees,16000 square feet, Who have offered  PCB Manufacturing Service for more than 10 years.With the state-of-the-art technologies we employ, along with our highly trained workforce we are able to ensure that every PCB we provide matches your design requirements.

 
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