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Brush Plate with Much Pressure: Sometimes, the brush plate is having much pressure due to which the tensile stress is causing pressure leading to base plate deformation.
Solution: The best possible solution for the problem is that brush must be adopted that the parameter of process is in best state as per brush plate. While for the thinner substrate, technology of chemical cleaning must be adopted or even process of electrolysis can be adopted.
Resins in Substrate: Sometimes the resins in substrate are not completely cured and are leading to change in dimensions.
Solution: The best solution for the problem is use of baking method. Before the drilling of baking temperature should be set to 1200 Celsius for about 4 hours to have surety that resins have cured for reducing the chances of deformation of the dimensions.
Soldering Ball Defects: The soldering ball is one of the most common defects that arise in the surface mount technology-based PCBs. The solder balls are located almost 0.13mm inside of the traces violating the principle of minimum electrical clearance. These are affecting the electrical reliability of the printed circuit boards assembling process. According to the A610 standard of IPC, the PCBs are considered defective if it has more than 5 solder balls within 600mm2.
Brush Plate with Much Pressure: Sometimes, the brush plate is having much pressure due to which the tensile stress is causing pressure leading to base plate deformation.
Solution: The best possible solution for the problem is that brush must be adopted that the parameter of process is in best state as per brush plate. While for the thinner substrate, technology of chemical cleaning must be adopted or even process of electrolysis can be adopted.
Resins in Substrate: Sometimes the resins in substrate are not completely cured and are leading to change in dimensions.
Solution: The best solution for the problem is use of baking method. Before the drilling of baking temperature should be set to 1200 Celsius for about 4 hours to have surety that resins have cured for reducing the chances of deformation of the dimensions.
Soldering Ball Defects: The soldering ball is one of the most common defects that arise in the surface mount technology-based PCBs. The solder balls are located almost 0.13mm inside of the traces violating the principle of minimum electrical clearance. These are affecting the electrical reliability of the printed circuit boards assembling process. According to the A610 standard of IPC, the PCBs are considered defective if it has more than 5 solder balls within 600mm2.
