Double sided BGA Assembly for energy product

1. Half-hole board, metal edging

With the rapid development of electronic products, high-density, multi-function and miniaturization have become the trend of the development. The quantity of components on the printed circuit board are increasing at a geometric exponential, while the size of the circuit board is constantly decreasing, and it is often necessary to collocate some small carrier boards. If the round hole of the small carrier board is soldered to the mother circuit board with solder, due to the large volume of the round hole, there may be a problem of false soldering, which makes the daughter and mother boards unable to be electrically connected, so the metallization half-hole board appears. The characteristics of metallized half-hole PCB are: the volume is small, and the unit side has a whole row of metallized half-holes. It can be soldered with the mother board or the pins of components as the daughter board through these metallized half-holes.