- All
- Product Name
- Product Keyword
- Product Model
- Product Summary
- Product Description
- Multi Field Search
| Quantity: | |
|---|---|
BYF
Special laminated structure
The matrix material is used as the substrate board (PP layer), coated with copper foil on one or both sides, and then made into the copper clad board (core layer) by hot laminating technology. PCBs with different layers are made by using the copper clad board and the substrate board with hot laminating. As circuit designs become more complex and high-speed, it has become a problem that how to ensure signal quality. In such a situation, we need to use the transmission line theory to analyze, and it becomes the key to control the characteristic impedance matching of the signal line. Inadequate impedance control will cause considerable signal reflection and distortion, leading to a failed design. Common signals, such as PCI bus, PCI-E bus, USB, Ethernet, DDR memory, LVDS signals, etc., all require impedance control. The impedance control ultimately needs to be realized by PCB design. Many times engineers will design out some special PP layers and core layers, considering to meet the impedance requirements. This also places higher requirements on the production capacity of PCB manufacturing factories. We have our own full set of production laminating equipments, helping us to strictly control the quality of laminated structures with special requirements.
Special laminated structure
The matrix material is used as the substrate board (PP layer), coated with copper foil on one or both sides, and then made into the copper clad board (core layer) by hot laminating technology. PCBs with different layers are made by using the copper clad board and the substrate board with hot laminating. As circuit designs become more complex and high-speed, it has become a problem that how to ensure signal quality. In such a situation, we need to use the transmission line theory to analyze, and it becomes the key to control the characteristic impedance matching of the signal line. Inadequate impedance control will cause considerable signal reflection and distortion, leading to a failed design. Common signals, such as PCI bus, PCI-E bus, USB, Ethernet, DDR memory, LVDS signals, etc., all require impedance control. The impedance control ultimately needs to be realized by PCB design. Many times engineers will design out some special PP layers and core layers, considering to meet the impedance requirements. This also places higher requirements on the production capacity of PCB manufacturing factories. We have our own full set of production laminating equipments, helping us to strictly control the quality of laminated structures with special requirements.
