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OSP, short for Organic Solderability Preservative, refers to a thin film that is formed at the surface of bare copper in a chemical method. This film features oxidation resistance, thermal shock resistance and anti-wettability, more suitable for developing requirement of SMT in electronic industry.
The main content of OSP is organic substance containing heterocyclic nitrogen such as alkylbenzimidazole, BTA (benzotriazole), benzimidazole etc. An organic film is coated on clean copper surface of PCB pad and through-hole via through complexation and cross-linking reaction. The key ingredient of OSP solution determines solderability and thermal resistance of PCB that can be illustrated from color changing state due to heat and film decomposition temperature, which is extremely significant to the soldering performance of surface mounting,
Thickness of OSP film should be in the range from 0.2μm to 0.5μm, neither too thick nor too thin. Otherwise, it fails to stop copper surface from oxidation if it is too thin while flux fails to totally dissolve OSP plane on copper surface in the process of assembly, which will lead to bad soldering instead.
The responsibility of OSP is to cut off humidity in order to stop oxidation of copper surface, to beat against high temperature and maintain activation and it can be easily melted by flux so as to keep excellent tin plating capacity. Furthermore, different from physical coating, OSP features such excellent selectivity that contaminant won't be generated on soldermask, carbon film or gold side.
OSP, short for Organic Solderability Preservative, refers to a thin film that is formed at the surface of bare copper in a chemical method. This film features oxidation resistance, thermal shock resistance and anti-wettability, more suitable for developing requirement of SMT in electronic industry.
The main content of OSP is organic substance containing heterocyclic nitrogen such as alkylbenzimidazole, BTA (benzotriazole), benzimidazole etc. An organic film is coated on clean copper surface of PCB pad and through-hole via through complexation and cross-linking reaction. The key ingredient of OSP solution determines solderability and thermal resistance of PCB that can be illustrated from color changing state due to heat and film decomposition temperature, which is extremely significant to the soldering performance of surface mounting,
Thickness of OSP film should be in the range from 0.2μm to 0.5μm, neither too thick nor too thin. Otherwise, it fails to stop copper surface from oxidation if it is too thin while flux fails to totally dissolve OSP plane on copper surface in the process of assembly, which will lead to bad soldering instead.
The responsibility of OSP is to cut off humidity in order to stop oxidation of copper surface, to beat against high temperature and maintain activation and it can be easily melted by flux so as to keep excellent tin plating capacity. Furthermore, different from physical coating, OSP features such excellent selectivity that contaminant won't be generated on soldermask, carbon film or gold side.
